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AIXTRON SE, together with its subsidiaries, provides deposition equipment to the semiconductor industry in Asia, Europe, and the Americas. It develops, produces, and installs equipment for the deposition of semiconductor materials; and offers deposition processes, consulting, training, customer support, and other related services, as well as peripheral devices and services for the operation of its systems. The company's product portfolio includes MOCVD, CVD and PECVD, and OVPD and PVPD systems. It also supplies deposition equipment for volume production, as well as for research and development and pre-series productions. The company's products are used in a range of compound semiconductors and optoelectronic applications, as well as lasers, LED, display technologies, optical and wireless data transmission, SiC and GaN power electronics, and other applications. AIXTRON SE was founded in 1983 and is headquartered in Herzogenrath, Germany.

ASMPT Limited, an investment holding company, engages in the research, design, development, manufacture, and marketing of machine and tools used in the semiconductor and electronics assembly industries. It operates in two segments, Semiconductor Solutions and Surface Mount Technology Solutions. The Semiconductor Solutions segment offers wire and die bonders, encapsulation solutions, test handlers, clip bonders, CIS equipment, TCB and flip chip bonders, mold under fill, panel molding, silver sintering, and laser grooving and dicing. This segment also provides metrology, automated optical inspection, singulation, trim and form, inspection, and test and packing solutions. The Surface Mount Technology Solutions segment offers assembly line solutions; DEK printing systems; SIPLACE placement systems; and ASM smart factory tools and services. It also offers agency, logistics, marketing, and property investment services; develops, produces, markets, and sells execution systems software solutions; and trades in semiconductor and surface mount technology equipment. The company operates in Singapore, China, Germany, Austria, Hungary, Romania, France, the Czech Republic, Poland, the Netherland, the United States, Mexico, Canada, Malaysia, Taiwan, Korea, Thailand, Japan, India, Vietnam, the Philippines, and internationally. ASMPT Limited was formerly known as ASM Pacific Technology Limited and changed its name to ASMPT Limited in June 2022. The company was incorporated in 1975 and is headquartered in Singapore.

ASMPT Limited, an investment holding company, engages in the design, manufacture, and marketing of machine and tools used in the semiconductor and electronics assembly industries worldwide. It operates in two segments, Semiconductor Solutions and Surface Mount Technology Solutions. The Semiconductor Solutions segment offers wire and die bonders, encapsulation solutions, test handlers, clip bonders, CIS equipment, TCB and flip chip bonders, mold under fill, panel molding, and laser grooving and dicing. The Surface Mount Technology Solutions segment provides assembly line solutions; DEK printing systems; SIPLACE placement systems; and ASM smart factory tools and services. It also offers agency, logistics, marketing, and property investment services; develops, produces, markets, and sells execution systems software solutions; and trades in semiconductor and surface mount technology equipment. ASMPT Limited was formerly known as ASM Pacific Technology Limited and changed its name to ASMPT Limited in June 2022. The company was incorporated in 1975 and is headquartered in Singapore.

Soitec S.A. designs and manufactures semiconductor materials worldwide. Its products are used to manufacture chips that are used in smart phones, tablets, computers, IT servers, and data centers, as well as electronic components in cars, connected devices, and industrial and medical equipment. It offers Fully Depleted Silicon-On-Insulator (FD-SOI) for automotive radar and processors, and PD-SOI and FinFET-SOI products for high-performance computing markets. The company also offers RF-SOI substrates for front-end module devices, as well as 4G LTE and 5G smartphones. In addition, it offers power-SOI; Smart photonics-SOI; Smart Imager-SOI; Auto Smartsic; Connect RF-GaN; and Gallium Nitride (GAN) Epitaxial wafers for energy efficient power management system. Soitec S.A. was incorporated in 1992 and is headquartered in Bernin, France.