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AERWINS Technologies Inc. develops and manufactures drones and other technology in the air infrastructure and air mobility space. The company is based in Tokyo, Japan.

Siliconware Precision Industries Co., Ltd. provides semiconductor packaging and testing services in the United States, China, Taiwan, Europe, and internationally. It provides packaging and testing solutions, including advanced packages, substrate packages, and lead-frame packages, as well as testing for logic and mixed signal devices to measure and ensure the performance, functionality, and reliability of packaged semiconductor devices. The company also offers turnkey services; and flip-chip and wafer bumping services. Its substrate packages category employs the ball grid array design, which utilizes a laminated substrate and places the electrical connections on the bottom of the package; and lead-frame packages that are characterized by a semiconductor chip encapsulated in a plastic molding compound with metal leads on the perimeter. The company's testing and other services include wafer probing that involves sorting the processed wafer for defects; final testing services for logic and mixed signal and RF integrated circuit packages; burn in services for testing products; and other testing services, such as system-level testing, lead/ball scanner, marking, and tape and reel services. It serves customers in the personal computer, communications, consumer integrated circuits, and non-commodity memory semiconductor markets. The company has a strategic alliance with Tsinghua Unigroup Ltd. Siliconware Precision Industries Co., Ltd. was founded in 1984 and is headquartered in Taichung, Taiwan.

VIA optronics AG, together with its subsidiaries, provides display solutions worldwide. It also develops, manufactures, and sells customized and application-specific metal mesh touch sensors and electrode base film materials for use in touch modules or other touch products. In addition, the company offers interactive display solutions, including curved display panels and solutions integrating multiple display touch assemblies; and optical bonding services, as well as licenses optical bonding process and sells related equipment. It serves automotive, consumer electronics, and industrial/specialized end markets. The company was founded in 2005 and is headquartered in Nuremberg, Germany. VIA optronics AG is a subsidiary of Integrated Micro-Electronics, Inc.

VIA optronics AG, together with its subsidiaries, provides display solutions worldwide. It also develops, manufactures, and sells customized and application-specific metal mesh touch sensors and electrode base film materials for use in touch modules or other touch products. In addition, the company offers interactive display solutions, including curved display panels and solutions integrating multiple display touch assemblies; and optical bonding services, as well as licenses optical bonding process and sells related equipment. It serves automotive, consumer electronics, and industrial/specialized end markets. The company was founded in 2005 and is headquartered in Nuremberg, Germany. VIA optronics AG is a subsidiary of Integrated Micro-Electronics, Inc.