ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services (EMS) in the United States, Taiwan, Asia, Europe, and internationally. The company offers packaging services, including flip-chip ball grid array (BGA), flip-chip chip scale package (fcCSP), advanced chip scale packages (aCSP), quad flat packages, thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, high-band package on package, and 3D chip packages; stacked die solutions in various package types; and copper wire and silver bonding solutions, as well as module-based solutions. It also provides advanced packages, including aCSP; fcCSP; flip-chip package in package, package on package, and BGA packages; hybrid, advanced single sided substrate, integrated passive device, high-bandwidth, and fan-out wafer-level packages; IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. In addition, the company offers a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and test-related services, as well as drop shipment services; and packaging, testing and shipment, and flip-chip and wafer bumping services. Further, it provides electronic manufacturing services in relation to computers, peripherals, communications, industrial, automotive, and storage and server applications; designs, assembles, manufactures, and sells electronic components and telecommunications equipment motherboards; develops, sells, and leases real estate properties; and produces substrates. The company serves customers in communication, computing, and consumer electronic/industrial/automotive sectors. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.
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