ASM Pacific Technology Limited, commonly known as ASMPT (OTCMKTS: ASMVF), is a global supplier of semiconductor and electronics assembly and packaging equipment. The company designs, manufactures and services a range of advanced automation solutions that support semiconductor back-end processes, surface-mount technology (SMT) assembly, advanced packaging, substrate handling and test operations. Its product portfolio includes high-precision pick-and-place machines, wafer grinding and thinning systems, die attach and flip-chip bonding tools, ball placement equipment and integrated test and inspection platforms.
ASMPT’s offerings are used by original equipment manufacturers (OEMs) and electronics manufacturers to assemble printed circuit boards, package integrated circuits and handle substrates across diverse applications—from consumer electronics and telecommunications to automotive and industrial systems. The company emphasizes modularity and scalability, enabling customers to configure production lines that meet evolving throughput, yield and miniaturization requirements.
Tracing its roots to ASM Assembly Systems in 1975, ASMPT has grown into a multi-national enterprise headquartered in Hong Kong. It operates manufacturing facilities and research and development centers across Asia, Europe and North America, serving leading semiconductor fabricators, packaging houses and contract electronics manufacturers worldwide. Over the decades, ASMPT has expanded its technology portfolio through in-house innovation and strategic acquisitions, strengthening its position in advanced packaging and substrate handling markets.
Under the leadership of Group Chief Executive Officer Clement K. M. Chow, ASMPT continues to invest in R&D and process automation, focusing on enabling next-generation semiconductor architectures and high-density electronic assemblies. The company maintains a service network to support customers through lifecycle management, process optimization and equipment upgrades, aiming to drive productivity improvements and accelerate time-to-market for cutting-edge electronic and semiconductor products.
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