ASM Pacific Technology Ltd. (ASMPT) is a Hong Kong–based supplier of semiconductor assembly and packaging equipment. The company’s product portfolio includes surface‐mount technology (SMT) pick‐and‐place machines, flip‐chip bonders, wire and die bonders, wafer‐level packaging platforms, ball placement systems and automated inspection solutions. Through these offerings, ASMPT supports a range of semiconductor packaging processes, enabling high‐density interconnects, enhanced thermal performance and cost‐efficient production for advanced electronic devices.
Tracing its heritage to the ASM International group, ASMPT was established to focus specifically on the assembly and packaging segment of the semiconductor value chain. Since its spin‐off, the company has expanded its footprint with sales, service and manufacturing facilities across Asia, Europe and the Americas. Its equipment is used by leading foundries, OSATs (outsourced semiconductor assembly and test providers) and electronics manufacturers in markets such as consumer electronics, automotive, telecommunications and industrial applications.
ASMPT invests heavily in research and development, operating multiple innovation centers dedicated to next‐generation packaging technologies, automation and process optimization. Headquartered in Hong Kong, the company maintains a global support network to deliver installation, training and after‐sales services. Its ongoing commitment to technological advancement aims to address the growing demand for smaller, faster and more energy‐efficient semiconductor devices.
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