Soitec is a leading provider of engineered semiconductor substrates, renowned for its development and production of silicon-on-insulator (SOI) wafers. Founded in 1992 as a spin-off from France’s Commissariat à l’Énergie Atomique (CEA), the company has pioneered numerous technologies that enable improvements in power efficiency, radio frequency performance and system integration. Soitec’s solutions are used across a broad spectrum of electronic applications, from high-end consumer devices to automotive powertrains and telecommunications infrastructure.
The company’s core product lines include FD-SOI (Fully Depleted Silicon-On-Insulator) wafers, RF-SOI wafers optimized for 5G and IoT connectivity, and power-oriented substrates such as silicon carbide (SiC) and gallium nitride (GaN) on silicon. These materials help semiconductor manufacturers reduce energy consumption, shrink chip footprints and enhance switching speeds. In addition, Soitec is expanding into next-generation photonic and compound semiconductor markets, targeting applications like laser sources, LiDAR and electric vehicle charging systems.
Soitec operates a global footprint, with its headquarters near Grenoble, France, complemented by manufacturing sites in Asia and engineering centers in North America and Europe. Through partnerships and long-term supply agreements with leading foundries and integrated device manufacturers, the company ensures close collaboration throughout the design and production cycles. This global approach allows Soitec to serve major semiconductor players and emerging innovators in diverse regions around the world.
Under the leadership of CEO Paul Boudre and a seasoned executive team, Soitec continues to invest heavily in research and development. The company’s roadmap emphasizes scalable production, yield optimization and the introduction of advanced substrate technologies. By aligning its product portfolio with the semiconductor industry’s evolving needs, Soitec aims to maintain its position at the forefront of materials innovation and support the next wave of high-performance electronic devices.
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