Tokyo Ohka Kogyo Co., Ltd. (OTCMKTS:TOKCF) is a Japan‐based specialty materials manufacturer founded in 1935 and headquartered in Kawasaki, Kanagawa Prefecture. Over its long history, the company has leveraged expertise in polymer chemistry to develop and supply critical materials for the semiconductor and flat panel display industries. Its early work with nitrocellulose lacquers paved the way for precision photoresist formulations that are now used in advanced microfabrication processes worldwide.
The company’s core business segments include electronic materials, polymer materials and advanced functional coatings. In its electronic materials division, Tokyo Ohka Kogyo produces a wide range of photoresists, anti-reflective coatings and ancillary chemicals designed for photolithography in semiconductor chip manufacturing. Its polymer materials unit develops specialized adhesives and bonding agents used in display panel assembly and optical device production. Additionally, the advanced functional coatings segment offers surface treatment solutions for glass, metal and plastic substrates to enhance durability, adhesion and optical properties.
Tokyo Ohka Kogyo serves a global customer base, with sales and technical support operations in Asia, North America and Europe. By maintaining research and development centers in Japan and overseas, the company stays at the forefront of evolving process requirements driven by shrinking device geometries and emerging display technologies. Its products are integrated into manufacturing lines by major semiconductor foundries, display makers and electronics assemblers, reflecting its reputation for high‐performance, reliable materials.
Although privately held divisions and subsidiary names vary by region, the company’s leadership has consistently emphasized innovation through collaboration with equipment suppliers, research institutes and end‐users. This focus on customer‐driven development has enabled Tokyo Ohka Kogyo to adapt its portfolio to next‐generation packaging approaches, 3D integration techniques and emerging applications such as flexible displays and compound‐semiconductor devices.
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