Chipmos Technologies (NASDAQ:IMOS) Inc. is a leading provider of semiconductor assembly and testing services, offering a comprehensive suite of packaging, wafer probe, and system-level test solutions. The company specializes in advanced logic and specialty memory packaging, as well as bumping services for a wide array of integrated circuits. Its service portfolio caters to a diverse customer base that includes memory device producers, fabless semiconductor companies, and original equipment manufacturers in the consumer electronics, communications, and computing industries.
Founded in the 1980s and headquartered in Hsinchu Science Park, Taiwan, ChipMOS has developed a track record of innovation in packaging technologies such as flip-chip, wire bonding, and wafer-level packaging. Over the years, the company has invested in research and development to support emerging applications in high-performance computing, mobile devices, and automotive electronics. Through its in-house capabilities, ChipMOS is able to offer turnkey solutions that span from wafer probe testing to final product packaging and reliability qualification.
ChipMOS operates multiple manufacturing and testing facilities across Asia, including sites in Taiwan, mainland China, and Singapore. These strategically located plants enable the company to serve a global clientele and to maintain flexible capacity for volume production and quick turnaround on prototyping projects. The company also maintains regional sales and customer support offices in North America, Europe, and Japan to facilitate close collaboration with international customers and ensure responsive technical service.
Management at ChipMOS is led by a group of industry veterans with deep expertise in semiconductor manufacturing, test engineering, and supply-chain logistics. The executive team emphasizes quality assurance and process control, holding key certifications and adhering to rigorous industry standards. Under their guidance, ChipMOS continues to expand its technological capabilities and strengthen partnerships with leading semiconductor vendors worldwide.
