Kulicke & Soffa Industries (NASDAQ: KLIC) is a leading provider of semiconductor assembly and packaging equipment, enabling the production of microelectronic devices used in smartphones, automotive systems, data centers and a wide range of consumer electronics. The company designs, manufactures and sells a comprehensive portfolio of wire bonders, die bonders, and flip chip bonders, as well as plating and test equipment. Its solutions are designed to improve yield, reduce cycle times and support advanced packaging processes for customers around the globe.
In addition to core bonding systems, Kulicke & Soffa offers advanced process control and automation software, inspection and metrology tools, and material handling solutions. The company’s equipment accommodates a variety of substrate types, including leadframes, laminate substrates and advanced interposers. Complementing its hardware offerings, Kulicke & Soffa provides aftermarket services such as installation, maintenance, spare parts and software upgrades, helping customers optimize equipment performance over the full lifecycle.
Founded in 1951 in Philadelphia by William Kulicke and Vera Soffa, the company has grown from a small bond tool manufacturer to a global enterprise with research, development and manufacturing facilities in North America, Europe and Asia. Over the decades, Kulicke & Soffa has pioneered key innovations such as the first automatic wire bonder and advanced wire routing technologies. The company’s global footprint spans major semiconductor hubs, including Taiwan, Korea, China, Japan and Singapore, where it supports an extensive network of service centers.
Headquartered in Singapore, Kulicke & Soffa is led by President and Chief Executive Officer Alan R. Lowe, who brings more than 25 years of experience in the semiconductor equipment industry. Under his leadership, the company has focused on accelerated product development, enhanced customer support and strategic investments in next-generation assembly technologies. With a diverse leadership team and a workforce of engineers and technical specialists worldwide, Kulicke & Soffa continues to address evolving market demands and drive innovation in chip assembly and packaging.
