Firan Technology Group (TSE:FTG) Shares Pass Above 50-Day Moving Average - Time to Sell?

Firan Technology Group Co. (TSE:FTG - Get Free Report)'s share price passed above its 50-day moving average during trading on Monday . The stock has a 50-day moving average of C$7.65 and traded as high as C$9.27. Firan Technology Group shares last traded at C$9.25, with a volume of 35,514 shares changing hands.

Wall Street Analyst Weigh In

A number of analysts have issued reports on the company. Raymond James raised Firan Technology Group to a "moderate buy" rating in a research report on Tuesday, April 8th. Acumen Capital lifted their price objective on Firan Technology Group from C$11.50 to C$12.00 and gave the stock a "buy" rating in a report on Friday, April 11th.

Firan Technology Group Stock Performance

The company has a market capitalization of C$224.06 million, a P/E ratio of 20.85 and a beta of 1.45. The company has a current ratio of 2.54, a quick ratio of 1.53 and a debt-to-equity ratio of 50.28. The company's fifty day moving average is C$7.73 and its 200 day moving average is C$7.62.

Insiders Place Their Bets

In other news, Director Mike Andrade acquired 10,000 shares of the business's stock in a transaction dated Friday, April 11th. The stock was bought at an average cost of C$7.80 per share, for a total transaction of C$78,000.00. Also, Senior Officer James Crichton sold 10,400 shares of the business's stock in a transaction that occurred on Monday, February 24th. The shares were sold at an average price of C$8.08, for a total transaction of C$84,032.00. Insiders have purchased a total of 15,100 shares of company stock worth $116,548 over the last 90 days. Corporate insiders own 32.64% of the company's stock.

Firan Technology Group Company Profile

Firan Technology Group Corporation manufactures and sells aerospace and defense electronic products and subsystems in Canada, the United States, Asia, Europe, and rest of Americas. The company operates in two segments, FTG Circuits and FTG Aerospace. It offers semi additive process technologies, high density interconnect products, high temperature rigid flex printed, RF boards, thermal management, and rigid flex and assembly products.