Wang & Lee Group, Inc., headquartered in Irvine, California, is a specialized provider of precision-engineered interconnect solutions for the semiconductor and electronics industries. Since its founding in 1992, the company has focused on the design, development and manufacture of high-reliability test sockets and related products used in the final testing of integrated circuits. Its product suite addresses the demanding electrical and mechanical requirements of modern chip packaging technologies.
The company’s core offerings include burn-in sockets, wafer prober adapters, chip-on-board fixtures and pogo pin test sockets, each engineered to facilitate accurate performance evaluation of semiconductor devices under extreme thermal and electrical conditions. Leveraging proprietary materials science and precision machining capabilities, Wang & Lee Group delivers products that help original equipment manufacturers (OEMs) and semiconductor foundries improve test throughput, yield and reliability throughout the production cycle.
Wang & Lee Group serves a global customer base spanning North America, Europe and Asia, with significant penetration in key markets such as automotive electronics, telecommunications, data storage and consumer electronics. By maintaining strategic manufacturing partnerships and localized sales support in major semiconductor hubs, the company is able to respond swiftly to shifts in customer demand and emerging process node requirements.
Guided by a management team with deep expertise in precision hardware and semiconductor testing, the company continues to invest in research and development to address the challenges of next-generation device architectures. Under the ongoing stewardship of its founders, who remain active on the board of directors, Wang & Lee Group pursues a measured growth strategy that emphasizes engineering excellence, close customer collaboration and operational efficiency.
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