COREwafer Industries, trading under the symbol AHIX on the OTC Markets, is a developer and manufacturer of engineered silicon wafer cores for advanced semiconductor packaging. The company specializes in delivering core wafer materials designed to meet the rigorous thermal, mechanical and electrical requirements of next‐generation integrated circuit packages. These core wafer products serve as the structural backbone for fan‐out wafer‐level packaging (FO‐WLP), embedded bridge substrates and other heterogeneous integration applications.
At the heart of COREwafer’s offerings is a lineup of high‐performance silicon cores that enable semiconductor assemblers and OSAT (outsourced semiconductor assembly and test) providers to achieve finer line pitches, improved heat dissipation and greater package reliability. In addition to standard thickness cores, the company engineers custom dielectric fill and redistribution layer-friendly surfaces, expanding design flexibility for advanced packaging architectures. COREwafer also provides technical support and design collaboration services to help customers integrate its materials into complex chip finite assemblies.
Founded in the late 2010s, COREwafer Industries established its headquarters in Southern California and maintains research partnerships and manufacturing alliances across Asia, including key wafer fabrication hubs in Taiwan and Korea. Over the past several years, the company has attracted strategic collaborations with foundries and test houses to accelerate adoption of its core wafer solutions in high‐volume production. This global footprint enables COREwafer to serve leading semiconductor customers in North America, Europe and the Asia‐Pacific region.
Under the leadership of Chief Executive Officer Andrew Underwood, COREwafer continues to expand its technology portfolio through internal R&D and targeted acquisitions. The company’s management team combines expertise in materials science, microfabrication and semiconductor process engineering. With a focus on scalable production and stringent quality controls, COREwafer aims to address the growing demand for miniaturized, high-performance packaging in applications ranging from mobile devices and automotive electronics to high-end computing and 5G infrastructure.
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