ASM Pacific Technology Limited (OTCMKTS:ASMVY) is a Hong Kong–based provider of semiconductor and electronic assembly equipment. The company specializes in designing and manufacturing surface-mount technology (SMT) placement machines, flip-chip bonders and systems for wafer-level packaging. Its solutions are used by electronics manufacturers, semiconductor foundries and outsourced assembly and test (OSAT) providers worldwide.
ASMPT’s product portfolio encompasses high-speed pick-and-place machines, thermal equipment for reflow and curing processes, and advanced deposition tools for etch, physical vapor deposition (PVD), plasma-enhanced chemical vapor deposition (PECVD) and atomic layer deposition (ALD) applications. In addition to capital equipment, the company offers spare parts, preventative maintenance services and technical support to maximize equipment uptime and productivity.
Founded in 1975, ASMPT maintains a global footprint with research and development centers and manufacturing facilities across Asia, Europe and North America. Its sales and service network spans major technology hubs in China, Taiwan, Japan, Europe and the United States, enabling close collaboration with key customers in the consumer electronics, communications and semiconductor industries.
Led by an experienced management team, ASMPT continues to invest in innovation to meet market demands for miniaturization, higher throughput and advanced packaging technologies. The company’s emphasis on research, global service capabilities and process expertise positions it as a strategic partner to the world’s leading electronics and semiconductor manufacturers.
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