ICOX Innovations, Inc. develops and manufactures advanced flexible electronic and microfluidic devices using proprietary thin‐metal substrate technologies. The company’s core Dynaflex™ and Dynaflex 2.0™ foil platforms enable the production of ultra‐thin, highly conductive circuit arrays, pressure sensors, and microfluidic components. These solutions are designed to meet demanding performance and durability requirements while offering significant weight and space savings compared with traditional rigid circuit assemblies.
Through its integrated design‐to‐manufacturing capabilities, ICOX serves a diverse range of end markets including aerospace, defense, industrial automation, medical diagnostics, and consumer electronics. Its product lineup spans flexible circuit boards, foil‐based antenna arrays, precision fluid‐handling chips, and embedded sensor systems. Many of these products are tailored for harsh‐environment applications, such as in‐flight monitoring systems, wearable health monitors, and portable diagnostic devices.
Founded in the mid‐20th century and headquartered in Irvine, California, ICOX has grown from a niche foil‐processing operation into a global technology company. Over the years, it has expanded its footprint with manufacturing and R&D facilities in North America and strategic partners in Europe and Asia. The company continually invests in process innovation—holding multiple patents on foil etching, lamination, and microfluidic channel formation techniques—to stay at the forefront of thin‐film electronics production.
ICOX Innovations is led by a seasoned management team with deep expertise in materials science, electronics manufacturing, and product development. Under the direction of Chief Executive Officer Patrick Mantinis and Chief Technology Officer Dr. Laura Jensen, the company focuses on scaling its production capabilities and accelerating time‐to‐market for next‐generation flexible circuits and sensor platforms. This leadership, combined with a network of strategic partners, positions ICOX to address evolving customer needs in high‐growth technology sectors worldwide.
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