Spectra7 Microsystems Inc. is a Canadian semiconductor company specializing in high-performance analog signal conditioning solutions for video and data connectivity. The company’s core technology focuses on extending the reach and reliability of high-speed interfaces such as USB-C, Thunderbolt, HDMI and DisplayPort. By integrating advanced equalization, filtering and retiming functions into compact ICs, Spectra7’s products enable active cables and adapters to deliver multi-gigabit data streams over longer cable lengths without compromising signal integrity.
Key offerings include the eGain+™ family of mixed-signal retimers and redrivers, which are designed to support the latest USB4 and Thunderbolt 4 specifications as well as legacy video standards. These silicon solutions help OEMs and cable manufacturers meet stringent industry requirements for power consumption, electromagnetic interference (EMI) and board space. Spectra7 also provides customized reference designs and engineering support to accelerate product development and certification for its customers.
Founded in 2008 and headquartered in Vancouver, British Columbia, Spectra7 has built partnerships with leading system vendors and cable producers around the world. The company completed its initial public offering on the TSX Venture Exchange in 2010 and maintains a secondary listing on the OTC Markets under the symbol SPVNF. Spectra7’s products are used in a range of applications including desktop and notebook computers, docking stations, broadcast and professional audio/video equipment, and industrial automation systems.
Under the leadership of Chief Executive Officer Farzin Houri, Spectra7 continues to expand its global footprint with design and support centers in North America and Asia. The management team combines expertise in analog and mixed-signal design with years of experience in the semiconductor and consumer electronics industries. Spectra7’s ongoing focus on research and development aims to address the evolving demands for higher data rates, smaller form factors and lower power consumption in next-generation connectivity solutions.
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