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LON:ENSI

EnSilica Final Earnings Report

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GBX 74.62 -1.38 (-1.82%)
As of 09/11/2026 12:29 PM Eastern

EnSilica EPS Results

Actual EPS
-GBX 0.23
Consensus EPS
N/A
Beat/Miss
N/A
One Year Ago EPS
N/A

EnSilica Revenue Results

Actual Revenue
N/A
Expected Revenue
N/A
Beat/Miss
N/A
YoY Revenue Growth
N/A

EnSilica Announcement Details

Quarter
Final
Time
Before Market Opens
Conference Call Date
N/A
Conference Call Time
N/A

Conference Call Resources

EnSilica Earnings Headlines

EnSilica (LON:ENSI) Stock Price Down 1.8% - Time to Sell?
EU Space & Comms Centre of Excellence
The retirement income that answers “yes” when everything else says no
Todd Phillips has spent 30 years studying safe-money income. He says most so-called income sources fail one test: can they promise the same payout, to the dollar, every year for life? Dividend stocks can be cut. REITs shift with tenants and rates. CDs mature and reset. Todd calls his find the 10.3% War Bond, a vehicle that does not trade on Wall Street and does not move with the market. Todd believes this current 10.3% rate will not stay available for long.tc pixel
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About EnSilica

Founded in 2001, EnSilica (LON:ENSI) began as a semiconductor design services business, building deep expertise in complex chip design. In 2016, the Company evolved into designing and supplying customer-funded ASICs (Application Specific Integrated Circuits), creating long-term recurring supply revenues. Today, EnSilica designs and supplies a complementary mix of ASICs and ASSPs (Application Specific Standard Products). ASICs are developed for individual customers, typically with customer-funded development, while EnSilica’s own ASSPs are designed for specific applications and sold to multiple customers, providing greater scale and higher-margin potential. Together, the two models provide an attractive balance: ASICs provide customer-funded innovation and long-term supply revenues, while ASSPs enable EnSilica to scale its technology across multiple customers and markets, with Space & Satellite Communications a key focus. Every ASIC and ASSP developed expands EnSilica’s reusable IP, technology and engineering know-how, enabling future chips to be developed faster and more efficiently. This creates a compounding business model where customer-funded development, recurring supply revenues, reusable IP and scalable products provide the foundations for continued growth.

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