Go Pro
OTCMKTS:BESIY

BE Semiconductor Industries Q3 2025 Earnings Report

BE Semiconductor Industries logo
$200.80 -18.03 (-8.24%)
As of 09:36 AM Eastern

BE Semiconductor Industries EPS Results

Actual EPS
$0.37
Consensus EPS
$0.31
Beat/Miss
Beat by +$0.06
One Year Ago EPS
N/A

BE Semiconductor Industries Revenue Results

Actual Revenue
$154.12 million
Expected Revenue
$160.84 million
Beat/Miss
Missed by -$6.72 million
YoY Revenue Growth
N/A

BE Semiconductor Industries Announcement Details

Quarter
Q3 2025
Time
Before Market Opens
Conference Call Date
N/A
Conference Call Time
N/A

Upcoming Earnings

BE Semiconductor Industries' next earnings date is estimated for Thursday, October 22, 2026, based on past reporting schedules.

Conference Call Resources

BE Semiconductor Industries Earnings Headlines

BE Semiconductor Industries N.V. ADR
They didn't warn anyone in 1971. This time someone is warning you.
On August 15, 1971, Nixon interrupted prime-time television and ended the gold standard in 15 minutes - no debate, no vote, one executive order. Gold tripled within three years and climbed 20x over the following decade. Trump holds that same executive authority today, and his advisors are openly saying a reversal is on the table. There are two ways this plays out - both move gold in the same direction. A free briefing breaks down exactly what Nixon did, why Trump is positioned to act, and how to move your 401k into gold before any announcement - tax free.tc pixel
See More BE Semiconductor Industries Headlines
Get Earnings Announcements in your inbox

Want to stay updated on the latest earnings announcements and upcoming reports for companies like BE Semiconductor Industries? Sign up for Earnings360's daily newsletter to receive timely earnings updates on BE Semiconductor Industries and other key companies, straight to your email.

About BE Semiconductor Industries

BE Semiconductor Industries (OTCMKTS:BESIY) N.V. (BESI) is a Netherlands-based semiconductor equipment manufacturer that develops, produces and markets systems used in the assembly and packaging of semiconductor devices. Its equipment is used by semiconductor manufacturers and outsourced semiconductor assembly and test providers to connect, protect and package semiconductor components after wafer fabrication.

The company’s product portfolio includes die-attach systems, packaging equipment and related solutions for advanced semiconductor applications. BESI also supplies plating systems used in semiconductor packaging, along with software, service and spare-parts support for its installed equipment. Its technologies serve applications including mobile communications, automotive electronics, computing, consumer electronics and other markets that use integrated circuits.

Founded in 1995, BESI is headquartered in Duiven, the Netherlands, and serves customers internationally through operations and sales activities in Europe, Asia and North America. The company is particularly active in major semiconductor manufacturing regions in Asia, where much of the world’s assembly and packaging capacity is located. Richard Blickman has served as BESI’s chief executive officer for many years and has been associated with the company’s expansion in advanced packaging equipment.

View BE Semiconductor Industries Profile