Disco (OTCMKTS:DSCSY) Shares Gap Down - Here's What Happened

Key Points

• Disco shares gapped down, opening at $41.255 (previous close $43.04) and last trading at $41.28, down about 3% with a volume of 51,585 shares.
• The company has a market cap of $45.28 billion and a trailing P/E of 52.18; it reported $0.22 EPS and $709.53 million in revenue for the most recent quarter, and analysts expect roughly 0.7 EPS for the current year.
• Disco is a manufacturer of precision semiconductor processing equipment—including wafer dicing, thinning, polishing systems and consumables—used across IC packaging, power devices, LEDs, MEMS and sensors.

Disco Corp (OTCMKTS:DSCSY - Get Free Report) gapped down before the market opened on Tuesday . The stock had previously closed at $43.04, but opened at $41.2550. Disco shares last traded at $41.28, with a volume of 51,585 shares.

Disco Trading Down 3.0%

The company has a 50 day simple moving average of $44.44 and a 200 day simple moving average of $36.09. The stock has a market capitalization of $45.28 billion, a PE ratio of 52.18 and a beta of 1.53.

Disco (OTCMKTS:DSCSY - Get Free Report) last announced its earnings results on Wednesday, January 21st. The company reported $0.22 earnings per share for the quarter. Disco had a return on equity of 25.92% and a net margin of 30.86%.The company had revenue of $709.53 million for the quarter. On average, equities research analysts predict that Disco Corp will post 0.7 EPS for the current year.

Disco Company Profile

Disco OTCMKTS: DSCSY is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company's product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco's products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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