Disco (OTCMKTS:DSCSY) Shares Gap Up - Should You Buy?

Key Points

• Shares gapped up: Disco opened at $46.79 versus a $44.73 close and last traded at $45.50 on volume 27,372, trading above its 50‑day ($42.73) and 200‑day ($35.05) moving averages with a market cap of $49.61B and a P/E of 57.16.
• Zacks upgraded the stock from "strong sell" to "hold"; one analyst rates it a Strong Buy and one a Hold, leaving a MarketBeat consensus rating of "Buy."
• The company reported Q results of EPS $0.22 on $709.53M revenue with a 30.86% net margin and 25.92% ROE, and sell‑side analysts forecast about 0.7 EPS for the current fiscal year; Disco manufactures precision semiconductor processing equipment.

Disco Corp (OTCMKTS:DSCSY - Get Free Report)'s stock price gapped up prior to trading on Wednesday . The stock had previously closed at $44.73, but opened at $46.79. Disco shares last traded at $45.50, with a volume of 27,372 shares.

Wall Street Analysts Forecast Growth

Separately, Zacks Research upgraded shares of Disco from a "strong sell" rating to a "hold" rating in a report on Tuesday, November 11th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Hold rating to the stock. According to MarketBeat.com, the stock presently has an average rating of "Buy".

Disco Price Performance

The firm has a fifty day moving average of $42.73 and a two-hundred day moving average of $35.05. The stock has a market capitalization of $49.61 billion, a P/E ratio of 57.16 and a beta of 1.53.

Disco (OTCMKTS:DSCSY - Get Free Report) last issued its earnings results on Wednesday, January 21st. The company reported $0.22 earnings per share (EPS) for the quarter. Disco had a net margin of 30.86% and a return on equity of 25.92%. The company had revenue of $709.53 million for the quarter. As a group, sell-side analysts forecast that Disco Corp will post 0.7 EPS for the current fiscal year.

About Disco

Disco OTCMKTS: DSCSY is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company's product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco's products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.

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