Soitec is a France-based semiconductor materials company that develops and manufactures engineered substrates used in the production of advanced electronic chips. Its materials are designed to improve semiconductor performance, energy efficiency, thermal management and integration, supporting applications across mobile communications, automotive electronics, industrial systems, consumer devices and high-performance computing.
The company’s product portfolio includes silicon-on-insulator (SOI) substrates, including its FD-SOI and RF-SOI platforms, as well as engineered substrates based on silicon carbide, gallium nitride and other advanced materials. Soitec’s Smart Cut technology enables the production of thin, high-quality semiconductor layers and is used in several of its substrate offerings.
Soitec was founded in 1992 in France and commercialized technology originating from research conducted with CEA-Leti. The company serves customers internationally and operates research, manufacturing and sales activities across Europe, Asia and the United States. Its principal industrial footprint includes facilities in France and Singapore, with additional operations supporting global customers and semiconductor supply chains.
Soitec is led by Chief Executive Officer Pierre Barnabé. The company is listed on Euronext Paris, and its American depositary shares trade in the over-the-counter market under the symbol SLOIY.
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