Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.
Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors. The company serves device manufacturers, foundries, OSATs and contract manufacturers, offering equipment, consumables and aftermarket services aimed at improving throughput, yield and process control in high-volume production environments.
Headquartered in Japan, Disco supports a global customer base through direct sales, regional subsidiaries and distributor partners. The company is traded in U.S. over-the-counter markets under the symbol DSCSY and is recognized as an established supplier of precision dicing and grinding solutions within the semiconductor equipment supply chain.
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