DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.
Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines. DISCO also provides related application engineering, maintenance and technical support to help manufacturers process semiconductor wafers and other materials with high accuracy.
Founded in Japan in 1937, the company has expanded its operations and customer support network internationally. DISCO serves semiconductor, electronics and other advanced-manufacturing customers across major technology markets, including Asia, North America and Europe. Its equipment and tools are used at multiple stages of semiconductor manufacturing, particularly in back-end processes such as wafer thinning, singulation and surface preparation.
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