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OTCMKTS:DSCSY

Disco Q1 2027 Earnings Report

Disco logo
$33.87 -0.78 (-2.25%)
As of 09/24/2026 03:59 PM Eastern

Disco EPS Results

Actual EPS
$0.20
Consensus EPS
N/A
Beat/Miss
N/A
One Year Ago EPS
N/A

Disco Revenue Results

Actual Revenue
$717.28 million
Expected Revenue
N/A
Beat/Miss
N/A
YoY Revenue Growth
N/A

Disco Announcement Details

Quarter
Q1 2027
Time
Before Market Opens
Conference Call Date
N/A
Conference Call Time
N/A

Conference Call Resources

Disco Earnings Headlines

Disco (DISPF): New Buy Recommendation for This Technology Giant
My top 3 AI picks for the next decade
Alexander Green bought Apple in 1996, recommended Nvidia at a split-adjusted 66 cents in 2004, and picked up Amazon and Netflix under $3 per share in 2005. Now the chief investment strategist at The Oxford Club has identified three AI stocks he believes could be the most profitable investments of the next decade.tc pixel
Disco Corp Earnings Call: AI Surge Meets FX Risk
See More Disco Headlines
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About Disco

Disco (OTCMKTS:DSCSY)oration, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.

Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines. DISCO also provides related application engineering, maintenance and technical support to help manufacturers process semiconductor wafers and other materials with high accuracy.

Founded in Japan in 1937, the company has expanded its operations and customer support network internationally. DISCO serves semiconductor, electronics and other advanced-manufacturing customers across major technology markets, including Asia, North America and Europe. Its equipment and tools are used at multiple stages of semiconductor manufacturing, particularly in back-end processes such as wafer thinning, singulation and surface preparation.

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