Amkor Technology, Inc. is a leading provider of semiconductor packaging and test services, offering a comprehensive suite of outsourced solutions that enable semiconductor companies to bring products to market efficiently. Established in 1968 and headquartered in Tempe, Arizona, Amkor has built a reputation for delivering advanced packaging technologies that address the performance, size and cost demands of a wide range of electronic applications.
The company’s core business activities include wafer bumping and probing, advanced packaging and final test services. Amkor’s portfolio spans through-silicon via (TSV) 3D packaging, fan-out wafer-level packaging (FOWLP), flip-chip, mold-over-leadframe and system-in-package (SiP) solutions. In addition to traditional test capabilities, Amkor provides final quality inspection, reliability screening and failure analysis to ensure the highest levels of product performance for its customers.
Amkor operates a global network of manufacturing and test facilities across key semiconductor hubs in Asia, including Korea, Taiwan, China, the Philippines, Malaysia and Vietnam, supported by sales and customer service offices in North America, Europe and Japan. This geographic footprint allows the company to offer just-in-time delivery and technical support to customers in industries such as mobile communications, automotive electronics, consumer devices, computing and industrial markets.
Under the leadership of President and Chief Executive Officer Steve Kelley, Amkor continues to invest in research and development to advance next-generation packaging technologies. Since its initial public offering in 1998, the company has focused on strategic partnerships and continuous process innovation to meet the evolving needs of the semiconductor industry and maintain its position as a trusted outsourcing partner.
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