Tokyo Electron (OTCMKTS:TOELY) Sees Large Volume Increase - Here's Why

Key Points

• Tokyo Electron Ltd. experienced a substantial 194% increase in trading volume, with 440,265 shares traded on Wednesday, despite the stock's price declining from $74.70 to $71.40.
• The company's quarterly earnings report showed an earnings per share (EPS) of $0.86, falling short of analysts' expectations by $0.03, with revenues of $3.80 billion compared to projected $4.10 billion.
• Tokyo Electron has a market capitalization of $66.14 billion and a P/E ratio of 18.45, indicating its position within the semiconductor equipment industry.

Shares of Tokyo Electron Ltd. (OTCMKTS:TOELY - Get Free Report) saw an uptick in trading volume on Wednesday . 440,265 shares traded hands during mid-day trading, an increase of 194% from the previous session's volume of 149,611 shares.The stock last traded at $71.40 and had previously closed at $74.70.

Tokyo Electron Stock Performance

The stock has a 50-day simple moving average of $86.98 and a 200 day simple moving average of $79.77. The company has a market cap of $67.12 billion, a P/E ratio of 18.73 and a beta of 1.73.

Tokyo Electron (OTCMKTS:TOELY - Get Free Report) last released its earnings results on Thursday, July 31st. The company reported $0.86 EPS for the quarter, missing the consensus estimate of $0.89 by ($0.03). Tokyo Electron had a net margin of 22.07% and a return on equity of 29.49%. The firm had revenue of $3.80 billion during the quarter, compared to analyst estimates of $4.10 billion. Sell-side analysts anticipate that Tokyo Electron Ltd. will post 3.23 earnings per share for the current fiscal year.

Tokyo Electron Company Profile

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.