Tokyo Electron (OTCMKTS:TOELY) Releases FY 2025 Earnings Guidance

Key Points

• Tokyo Electron has updated its FY 2025 earnings guidance, projecting an EPS of $6.70 and revenue of $16.3 billion.
• Following the earnings guidance update, Tokyo Electron's stock declined by 14.8%, trading at $78.04 with a significant increase in trading volume.
• The company reported a quarterly EPS of $0.86, with analysts expecting a projected EPS of $3.23 for the current year.

Tokyo Electron (OTCMKTS:TOELY - Get Free Report) updated its FY 2025 earnings guidance on Thursday. The company provided EPS guidance of 6.700-6.700 for the period. The company issued revenue guidance of $16.3 billion-$16.3 billion.

Tokyo Electron Stock Performance

Shares of OTCMKTS TOELY traded up $3.72 during mid-day trading on Monday, reaching $77.28. 35,927 shares of the company's stock were exchanged, compared to its average volume of 145,562. The firm has a market capitalization of $71.21 billion, a price-to-earnings ratio of 19.87 and a beta of 1.73. Tokyo Electron has a 52-week low of $58.17 and a 52-week high of $98.68. The company's 50-day moving average is $87.65 and its 200-day moving average is $80.25.

Tokyo Electron (OTCMKTS:TOELY - Get Free Report) last announced its earnings results on Thursday, July 31st. The company reported $0.86 EPS for the quarter, missing analysts' consensus estimates of $0.89 by ($0.03). Tokyo Electron had a net margin of 22.07% and a return on equity of 29.49%. The firm had revenue of $3.80 billion for the quarter, compared to analysts' expectations of $4.10 billion. As a group, equities analysts predict that Tokyo Electron will post 3.23 earnings per share for the current fiscal year.

About Tokyo Electron

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.