Meyer Burger Technology AG, a technology company, provides systems and processes based on semiconductor technologies. It operates through Photovoltaics and Specialised Technologies segments. The company provides flexible systems for large area plasma processing, thin film encapsulation products, wire saws for hard and brittle materials, cell coating technologies, diamond wire saws, inkjet printing production platform, wafer inspection systems, control systems and software solutions, consumables, squaring of multi-ingots, and cell connection, as well as inkjet printing tools and pick-and-place and micro-assembly tools. It also offers production and production line controls, manufacturing execution systems, process and quality management systems, performance analysis equipment, interfaces, and coating and stripping equipment; integrated cells, module testers, flexible systems plasma etching and deposition, and laminators; and flexible process systems for research and production, module inspection systems, and retrofit inner diameter saws. In addition, the company provides multi-use cutting systems, cell testers, cluster tool controllers, in-line oven for heat treatments, hybrid electronics production system, equipment integration, and machine data acquisition products; and services, such as installation, academy training, overhaul, upgrades and retrofits, process support, onsite repair, and warranty extension services. It operates in Switzerland, Germany, rest of Europe, Asia, the United States, and internationally. The company has a strategic partnership with Oxford Photovoltaics Limited to develop mass production technology for perovskite on silicon Heterojunction tandem cells. Meyer Burger Technology AG was founded in 1953 and is headquartered in Thun, Switzerland.
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