ChipMOS Technologies Inc. is a Taiwan-based semiconductor assembly and testing company that provides outsourced semiconductor packaging and testing services. The company supports integrated-circuit manufacturers and electronics companies by handling portions of the back-end semiconductor production process, including wafer testing, assembly, packaging, and final testing.
Its service and product offerings include packaging and testing for memory, logic, mixed-signal, and display driver integrated circuits. ChipMOS also provides wafer bumping, wafer sorting, chip-on-film and other advanced packaging services used in applications such as consumer electronics, display panels, communications equipment, automotive electronics, and computing devices.
Founded in 1997, ChipMOS is headquartered in Taiwan and has developed manufacturing and testing capabilities serving customers in Taiwan and other major electronics markets. The company’s operations are focused on providing high-volume, specialized semiconductor back-end services to global customers, while its Nasdaq-listed American depositary shares trade under the symbol IMOS.
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