Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY - Get Free Report) have received an average recommendation of "Moderate Buy" from the nine ratings firms that are currently covering the firm, Marketbeat Ratings reports. One equities research analyst has rated the stock with a sell rating, three have given a hold rating, four have given a buy rating and one has assigned a strong buy rating to the company.
Several brokerages have recently issued reports on BESIY. Morgan Stanley reaffirmed an "overweight" rating on shares of BE Semiconductor Industries in a research report on Tuesday, September 8th. Zacks Research downgraded shares of BE Semiconductor Industries from a "strong-buy" rating to a "hold" rating in a report on Friday, September 25th. UBS Group lowered shares of BE Semiconductor Industries from a "buy" rating to a "sell" rating in a research report on Wednesday, October 7th. Finally, Berenberg Bank upgraded shares of BE Semiconductor Industries from a "hold" rating to a "strong-buy" rating in a report on Tuesday, August 4th.
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BE Semiconductor Industries Stock Performance
OTCMKTS BESIY opened at $171.49 on Friday. BE Semiconductor Industries has a 1 year low of $140.07 and a 1 year high of $374.33. The company has a debt-to-equity ratio of 0.60, a current ratio of 4.28 and a quick ratio of 3.73. The firm has a market cap of $12.43 billion, a price-to-earnings ratio of 40.83 and a beta of 1.99. The company has a fifty day moving average price of $206.82 and a 200-day moving average price of $246.22.
BE Semiconductor Industries Company Profile
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BE Semiconductor Industries N.V. (BESI) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to package semiconductor devices after wafer fabrication, helping customers assemble, connect, protect and test chips for use in electronic products.
BESI's product portfolio includes die-attach equipment, packaging systems, molding equipment and singulation systems. Its technologies support applications such as advanced semiconductor packaging, flip-chip assembly, thermo-compression bonding and hybrid bonding, which are used in products requiring higher performance, smaller dimensions and improved power efficiency.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI serves semiconductor manufacturers and assembly and test providers worldwide.
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