CPS Technologies Corp is a materials technology company specializing in the design and manufacture of advanced engineered composites and metal systems. The company develops bonded metal components, high-performance polymer composites and ceramic-to-metal brazed assemblies that address the demanding requirements of high-temperature, high-stress and high-frequency applications. CPS Technologies’ product portfolio includes thermal management solutions, electromagnetic interference (EMI) shielding materials, structural composites and electronic packaging substrates tailored for critical end markets.
Serving the aerospace, defense, electronics and energy industries, CPS Technologies works closely with original equipment manufacturers and system integrators to deliver custom materials solutions that reduce weight, improve thermal efficiency and enhance mechanical performance. Its capabilities cover all stages of product development, from material formulation and prototyping through volume production and rigorous testing. By integrating metallurgy, ceramic processing and polymer chemistry, the company offers unique combinations of properties—such as conductivity, corrosion resistance and mechanical strength—that enable customers to meet stringent performance and reliability standards.
Headquartered in Westborough, Massachusetts, CPS Technologies operates a network of manufacturing and sales facilities across North America, Europe and Asia. The company’s global footprint supports high-mix, low-volume production runs as well as scale-up for larger programs. CPS Technologies’ focus on vertical integration and process control helps ensure consistency, traceability and rapid response to evolving customer requirements in sectors where material performance is mission-critical.
Publicly traded on the NASDAQ under the symbol CPSH, CPS Technologies draws on decades of experience in materials science and engineering. Its management team comprises industry veterans in composite and metal fabrication who guide strategic investments in research and development. Through ongoing collaboration with academic and industry partners, the company continues to expand its portfolio of proprietary materials and strengthen its position in markets driven by weight reduction, thermal management and advanced electronic packaging.
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