Ultra Clean Holdings, Inc. is a global supplier of critical consumables and process tools for the semiconductor manufacturing industry. The company specializes in precision parts cleaning, chemical–mechanical planarization (CMP) slurries, surface conditioning pads, and specialty components used in wafer fabrication and advanced packaging. Ultra Clean also provides assembly and test hardware, tooling, and automated modules designed to support complex front-end and back-end processes in semiconductor fabs.
Ultra Clean’s product portfolio encompasses a range of cleaning systems and consumables aimed at particle and film removal, as well as CMP slurries and pads that are engineered for uniform material removal and planarization. The company’s automated modules integrate fluid delivery, process control, and waste management to optimize tool performance and yield. Its surface conditioning products are tailored for chemical application and pad maintenance across a variety of semiconductor geometries and materials.
With a manufacturing and R&D footprint spanning North America and Asia, Ultra Clean serves leading semiconductor manufacturers and research institutions around the world. Key production and service facilities are located in California, Texas, Malaysia, Singapore, Taiwan, and China. This global presence enables the company to offer responsive technical support, supply chain continuity, and localized engineering expertise.
Founded in 1992 and headquartered in Fremont, California, Ultra Clean completed its initial public offering in March 1998. Under the leadership of President and CEO Dan P. Keough, the company continues to invest in process development and strategic partnerships to address the evolving needs of the semiconductor industry, including next-generation nodes and advanced packaging technologies.
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