BE Semiconductor Industries N.V. (Besi) is a Netherlands-based manufacturer of semiconductor assembly equipment. The company develops and supplies systems used to assemble, package, and finish semiconductor devices after wafer fabrication.
Besi’s product portfolio includes die-attach equipment, packaging systems, molding and singulation equipment, plating systems, and related solutions for advanced semiconductor packaging. Its technologies support applications such as flip-chip, wafer-level packaging, thermo-compression bonding, and hybrid bonding, which are used in electronics, communications, automotive, computing, and other semiconductor markets.
Founded in 1995 and headquartered in Duiven, the Netherlands, Besi serves semiconductor manufacturers and assembly and test providers worldwide. The company has operations and customer support activities across Europe, Asia, and North America. Richard Blickman has served as Besi’s chief executive officer for many years.
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