BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999. Since its inception, the company has broadened its technology portfolio to address emerging packaging trends such as wafer-level fan-out, 3D integration and heterogeneous assembly. Over the years, BESI has invested in R&D to enhance automation, alignment accuracy and thermal management capabilities in its equipment, keeping pace with evolving device architectures and form factors.
BESI serves a diverse customer base that includes leading semiconductor manufacturers, foundries and outsourced assembly and test providers. The company maintains development, production and service facilities across Asia, Europe and North America, with key operating sites in Singapore, Malaysia, China, the Philippines, South Korea, the United States and the Netherlands. This global footprint enables BESI to provide local application support and timely after-sales service to its customers.
Since October 2018, BESI has been led by CEO Koos Timmer, who brings extensive experience in semiconductor equipment and strategic business development. Under his leadership, the company has sharpened its focus on advanced packaging solutions and market expansion, reinforcing its position as a partner of choice for high-precision assembly equipment in a rapidly evolving semiconductor landscape.
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