Amkor Technology, Inc. (NASDAQ:AMKR) is a leading provider of outsourced semiconductor packaging and test (OSAT) services, supporting integrated device manufacturers and semiconductor foundries worldwide. The company offers a broad range of advanced packaging solutions, including wafer bumping, flip chip, system-in-package and ball grid array technologies, designed to meet the performance, power and form-factor demands of applications across consumer electronics, automotive, communications and industrial markets.
In addition to packaging, Amkor delivers comprehensive test services such as wafer probing, final test, system-level test and digital, analog and mixed-signal testing, enabling customers to accelerate time-to-market and reduce total costs. The company’s expertise extends to memory packaging and wafer-level packaging, reflecting its commitment to innovation in 2.5D and 3D packaging architectures and heterogeneous integration techniques.
Headquartered in Tempe, Arizona, Amkor operates a global network of manufacturing and test facilities across Asia, Europe and the United States, including sites in South Korea, Taiwan, Japan, China, Malaysia, the Philippines, Portugal and Vietnam. This geographic footprint allows the company to serve a diversified customer base and adapt quickly to regional market requirements and supply chain dynamics.
Founded as a spin-off of Motorola’s packaging and test operations in the late 1960s, Amkor has grown through strategic investments in capacity expansion and advanced process development. The company has been publicly traded on the Nasdaq Stock Market under the ticker AMKR since the late 1990s. Under the leadership of President and Chief Executive Officer Steven W. Kelley, Amkor continues to pursue technology leadership and operational excellence to address the evolving needs of the semiconductor industry.
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