Kulicke and Soffa Industries, Ltd. (NASDAQ: KLIC) designs, manufactures and supports equipment used in the assembly and packaging of semiconductor and electronic components. Its technologies help manufacturers connect semiconductor dies to packages, attach and assemble components, and produce finished devices for use in electronics, communications, automotive, industrial and other applications.
The company’s product portfolio includes wire bonding equipment, die attach systems, wedge bonding solutions and related tools, materials and services. Kulicke and Soffa also develops equipment for advanced packaging, power semiconductors, light-emitting diodes and other specialized semiconductor applications. In addition to selling equipment, the company provides spare parts, customer support, training and other services intended to assist with production and equipment maintenance.
Kulicke and Soffa traces its origins to the semiconductor equipment businesses associated with Kulicke and Soffa, which were established in the mid-20th century. The company is headquartered in Singapore and serves semiconductor and electronics manufacturers through a global sales, service and support network. Fusen Chen serves as the company’s president and chief executive officer.
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