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SEI High Yield Bond & Alternative Credit ETF (LEND) Dividend Yield, Date & History

SEI High Yield Bond & Alternative Credit ETF logo
$24.10 -0.07 (-0.29%)
As of 10/13/2026 03:59 PM Eastern

SEI High Yield Bond & Alternative Credit ETF Dividend Summary

Dividend Yield
2.66%
Annual Dividend
$0.64
Recent
Dividend Payment
Oct. 6

SEI High Yield Bond & Alternative Credit ETF (LEND) pays dividends, with an annual dividend of $0.64 per share and a dividend yield of 2.66%. Investors who owned the stock before the ex-dividend date of Monday, October 5, 2026 received the most recent payment of $0.1343 per share, paid on Tuesday, October 6, 2026.

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Skip Charts & View Dividend History

LEND Dividend Payments by Quarter

The chart below displays up to four years of SEI High Yield Bond & Alternative Credit ETF's dividend payment history by quarter. The blue bars represent historical dividend payments, while the gray bars indicate future payments.

LEND Dividend Yield Over Time

The chart below tracks SEI High Yield Bond & Alternative Credit ETF's dividend yield over the past four years. The line represents changes in yield by quarter, providing a clear view of trends over time.

SEI High Yield Bond & Alternative Credit ETF vs. The Competition

Compare SEI High Yield Bond & Alternative Credit ETF's annual dividend and yield with averages for and NASDAQ companies to evaluate its performance against the market.

TypeSEI High Yield Bond & Alternative Credit ETF CompaniesNASDAQ Companies
Annual Dividend$0.64$0.02$1.83
Dividend Yield2.66%13.75%22.89%

SEI High Yield Bond & Alternative Credit ETF Dividend History by Quarter

Dividend Date
0 Results
AnnouncedPeriodPaymentPayment ChangeYieldEx-Dividend DateRecord DatePayable Date
10/2/2026monthly$0.1343+$0.0136
11.30%
6.67%10/5/202610/5/202610/6/2026
9/2/2026$0.1206-$0.0206
14.56%
9/3/20269/3/20269/4/2026
8/4/2026$0.1412-$0.1038
42.37%
8/5/20268/5/20268/6/2026
7/2/2026monthly$0.2450-$0.7359
75.02%
7/6/20267/6/20267/7/2026

This table shows SEI High Yield Bond & Alternative Credit ETF's dividend history, including payout amounts, yield, dividend changes, and key dates. Use the date filter to explore data as far back as 2013 to analyze trends over time.

SEI High Yield Bond & Alternative Credit ETF Dividend - Frequently Asked Questions

The current dividend yield for SEI High Yield Bond & Alternative Credit ETF is 2.66%. Learn more on LEND's dividend yield history.

The annual dividend for LEND shares is $0.64. Learn more on LEND's annual dividend history.

SEI High Yield Bond & Alternative Credit ETF pays monthly dividends to shareholders.

SEI High Yield Bond & Alternative Credit ETF's most recent monthly dividend payment of $0.1343 per share was made to shareholders on Tuesday, October 6, 2026.

SEI High Yield Bond & Alternative Credit ETF's most recent ex-dividend date was Monday, October 5, 2026.

The most recent change in the company's dividend was an increase of $0.0136 on Friday, October 2, 2026.


MarketBeat compiles SEI High Yield Bond & Alternative Credit ETF dividend data from multiple sources, with the most recent dividend announced on 10/2/2026.
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